当前位置：首页 > 制程能力 | 序号 | 内容 | 常规 | 特殊 |
|---|---|---|---|
| 1 |
层数 NO.OF LAYER |
1～8层 | |
| 2 |
完成板尺寸(最大) FINISHED BOARD SIAE (MAX) |
250*1200mm | |
| 3 |
完成板尺寸(最小) FINISHED BOARD SIAE (MIN) |
2.5mm*2.5mm | |
| 4 |
板厚度(最小) BOARD THICKNESS (MIN) |
3 mil (0.07mm) | |
| 5 |
成品厚度公差 FINESHED BOARD THICKNESS FOLERANCE |
±1mil(±0.025mm) | |
| 6 | 钻孔孔径(最小) DRILL HOLE DIAMETER (MIN) | 0.10mm | |
| 7 | 外形精度 | ±0.05mm | ±0.025mm |
| 8 |
底铜厚度 OUTER LAYER BASE COPPER THICKNESS |
12um-70um | |
| 9 |
材料类型 BASE.MATERIAL |
PI聚酰亚胺/PET聚脂 | 无胶基材 |
| 10 |
最小线宽/间距 MINIMUM LINE WIDTH/SPACING |
0.035mm/0.035mm | |
| 11 |
蚀刻公差 TOLERANCE AFTER ETCHING |
≦±0.015mm | |
| 12 |
CVL对位精度贴合公差 CVL REGISTRATION(MIN) |
±8mil (±0.2MM) | ±0.1MM |
| 13 |
镀金厚度(plating) AU PLATING THICKNESS |
(0.03-0.05UM) | 厚金1-2UM |
